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Remember: Safety First. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly.

Disconnecting or reconnecting any receiver electrical plug or other electrical connection. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM, FETVOM, etc equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

Do not spray chemicals on or near this receiver or any of its assemblies. Unless specified otherwise in this service manual, lubrication of contacts in not required. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last. Use with this receiver only the test fixtures specified in this service manual. Electrostatically Sensitive ES Devices Some semiconductor solid-state devices can be damaged easily by static electricity.

Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground.

Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.

Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Minimize bodily motions when handling unpackaged replacement ES devices.

General Soldering Guidelines 1. Keep the soldering iron tip clean and well tinned. Thoroughly clean the surfaces to be soldered. Use a mall wire- bristle 0. Do not use freon-propelled spray-on cleaners. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. Heat the component lead until the solder melts. Quickly draw the melted solder with an anti-static, suction- type solder removal device or with solder braid.

Use the following soldering technique. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.


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